VARIoT IoT vulnerabilities database

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CWE format is 'CWE-number'. Threat type can be: remote or local
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VAR-202101-0102 CVE-2020-11225 plural  Qualcomm  Classic buffer overflow vulnerability in the product CVSS V2: 10.0
CVSS V3: 9.8
Severity: CRITICAL
Out of bound access in WLAN driver due to lack of validation of array length before copying into array in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wired Infrastructure and Networking. plural Qualcomm The product contains a classic buffer overflow vulnerability and an out-of-bounds write vulnerability.Information is obtained, information is tampered with, and service is disrupted (DoS) It may be put into a state. The Qualcomm chip is a chip of Qualcomm (Qualcomm). A way to miniaturize circuits (mainly including semiconductor equipment, but also passive components, etc.) and often manufactured on the surface of semiconductor wafers. Many Qualcomm products have security vulnerabilities, which stem from the lack of verification of the length of the array before copying to the array, so the range of access in the WLAN driver is not restricted
VAR-202101-0100 CVE-2020-11216 plural  Qualcomm  Integer overflow vulnerability in product CVSS V2: 7.5
CVSS V3: 9.8
Severity: CRITICAL
Buffer over read can happen in video driver when playing clip with atomsize having value UINT32_MAX in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables. plural Qualcomm The product contains an integer overflow vulnerability and an out-of-bounds read vulnerability.Information is obtained, information is tampered with, and service is disrupted (DoS) It may be put into a state. The Qualcomm chip is a chip of Qualcomm (Qualcomm). A way to miniaturize circuits (mainly including semiconductor equipment, but also passive components, etc.) and often manufactured on the surface of semiconductor wafers. A number of Qualcomm products have input verification error vulnerabilities. The vulnerability originates from the possibility of buffer overreading in the video driver when playing a clip with the atomsize value of UINT32 MAX in Snapdragon
VAR-202101-0094 CVE-2020-11197 plural  Qualcomm  Integer overflow vulnerability in product CVSS V2: 7.5
CVSS V3: 9.8
Severity: CRITICAL
Possible integer overflow can occur when stream info update is called when total number of streams detected are zero while parsing TS clip with invalid data in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables. plural Qualcomm The product is vulnerable to integer overflow.Information is obtained, information is tampered with, and service is disrupted (DoS) It may be put into a state. The Qualcomm chip is a chip of Qualcomm (Qualcomm). A way to miniaturize circuits (mainly including semiconductor equipment, but also passive components, etc.) and often manufactured on the surface of semiconductor wafers. Many Qualcomm products have an input verification error vulnerability. The vulnerability originates from when parsing TS clips with invalid data. If the stream information update is called when the total number of streams detected is zero, an integer overflow may occur
VAR-202101-0095 CVE-2020-11200 plural  Qualcomm  Product input verification vulnerabilities CVSS V2: 5.0
CVSS V3: 7.5
Severity: HIGH
Buffer over-read while parsing RPS due to lack of check of input validation on values received from user side. in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile. plural Qualcomm The product contains an input verification vulnerability and an out-of-bounds read vulnerability.Denial of service (DoS) It may be put into a state. The Qualcomm component is a component of Qualcomm Corporation. Provides the internal components of Qualcomm device functions. Many Qualcomm products have security vulnerabilities
VAR-202101-0096 CVE-2020-11212 plural  Qualcomm  Out-of-bounds read vulnerabilities in the product CVSS V2: 7.5
CVSS V3: 9.8
Severity: CRITICAL
Out of bounds reads while parsing NAN beacons attributes and OUIs due to improper length of field check in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wired Infrastructure and Networking. plural Qualcomm The product contains an out-of-bounds read vulnerability.Information is obtained, information is tampered with, and service is disrupted (DoS) It may be put into a state. The Qualcomm component is a component of Qualcomm Corporation. Provides the internal components of Qualcomm device functions. Many Qualcomm products have security vulnerabilities, which are caused by incorrect field check lengths, which are read out of range when parsing the attributes of NAN beacons and OUI
VAR-202101-0092 CVE-2020-11183 plural  Qualcomm  Classic buffer overflow vulnerability in the product CVSS V2: 7.2
CVSS V3: 6.7
Severity: MEDIUM
A process can potentially cause a buffer overflow in the display service allowing privilege escalation by executing code as that service in Snapdragon Auto, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables. plural Qualcomm The product contains a classic buffer overflow vulnerability.Information is obtained, information is tampered with, and service is disrupted (DoS) It may be put into a state. The Qualcomm chip is a chip of Qualcomm (Qualcomm). A way to miniaturize circuits (mainly including semiconductor equipment, but also passive components, etc.) and often manufactured on the surface of semiconductor wafers
VAR-202101-0087 CVE-2020-11152 plural  Qualcomm  Product Race Condition Vulnerabilities CVSS V2: 6.9
CVSS V3: 6.4
Severity: MEDIUM
Race condition in HAL layer while processing callback objects received from HIDL due to lack of synchronization between accessing objects in Snapdragon Auto, Snapdragon Compute, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables. plural Qualcomm The product contains a race condition vulnerability.Information is obtained, information is tampered with, and service is disrupted (DoS) It may be put into a state. The Qualcomm chip is a chip of Qualcomm (Qualcomm). A way to miniaturize circuits (mainly including semiconductor equipment, but also passive components, etc.) and often manufactured on the surface of semiconductor wafers. Many Qualcomm products have a race condition vulnerability, which is caused by the lack of synchronization between access objects, leading to race conditions in the HAL layer
VAR-202101-0088 CVE-2020-11167 plural  Qualcomm  Integer overflow vulnerability in product CVSS V2: 10.0
CVSS V3: 9.8
Severity: CRITICAL
Memory corruption while calculating L2CAP packet length in reassembly logic when remote sends more data than expected in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables. plural Qualcomm The product contains an integer overflow vulnerability and an out-of-bounds write vulnerability.Information is obtained, information is tampered with, and service is disrupted (DoS) It may be put into a state. The Qualcomm chip is a chip of Qualcomm (Qualcomm). A way to miniaturize circuits (mainly including semiconductor equipment, but also passive components, etc.) and often manufactured on the surface of semiconductor wafers. Many Qualcomm products have an input verification error vulnerability. The vulnerability stems from memory corruption when calculating the length of the L2CAP data packet in the reassembly logic when the data sent remotely exceeds expectations
VAR-202101-0083 CVE-2020-11148 plural  Qualcomm  Product Free Memory Usage Vulnerability CVSS V2: 7.2
CVSS V3: 6.7
Severity: MEDIUM
Use after free issue in HIDL while using callback to post event in Rx thread when internal mutex is not acquired and meantime close is triggered and callback instance is deleted in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wearables. plural Qualcomm The product contains a vulnerability related to the use of freed memory.Information is obtained, information is tampered with, and service is disrupted (DoS) It may be put into a state. The Qualcomm chip is a chip of Qualcomm (Qualcomm). A way to miniaturize circuits (mainly including semiconductor equipment, but also passive components, etc.) and often manufactured on the surface of semiconductor wafers. Many Qualcomm products have resource management error vulnerabilities. The vulnerability originates from the use of callbacks to release the problem in HIDL when the event is released in the RID thread when the internal mutex is not obtained and the callback instance is triggered to close and delete at the same time
VAR-202101-0081 CVE-2020-11145 plural  Qualcomm  Product vulnerabilities to division by zero CVSS V2: 5.0
CVSS V3: 7.5
Severity: HIGH
Divide by zero issue can happen while updating delta extension header due to improper validation of master SN and extension header SN in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables. plural Qualcomm The product is vulnerable to division by zero.Denial of service (DoS) It may be put into a state. The Qualcomm chip is a chip of Qualcomm (Qualcomm). A way to miniaturize circuits (mainly including semiconductor equipment, but also passive components, etc.) and often manufactured on the surface of semiconductor wafers. Numerous Qualcomm products have digital error vulnerabilities, which are caused by incorrect verification of the main SN and extended header SN. Therefore, the division by zero problem may occur when updating the incremental extension header
VAR-202101-0080 CVE-2020-11144 plural  Qualcomm  Product input verification vulnerabilities CVSS V2: 6.4
CVSS V3: 9.1
Severity: CRITICAL
Buffer over-read while UE process invalid DL ROHC packet for decompression due to lack of check of size of compresses packet in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables. plural Qualcomm The product contains an input verification vulnerability and an out-of-bounds read vulnerability.Information is obtained and denial of service (DoS) It may be put into a state. The Qualcomm chip is a chip of Qualcomm (Qualcomm). A way to miniaturize circuits (mainly including semiconductor equipment, but also passive components, etc.) and often manufactured on the surface of semiconductor wafers. Many Qualcomm products have a buffer error vulnerability. The vulnerability is caused by the failure to check the size of the compressed package, and the UE will decompress it when it processes invalid DL ROHC packages
VAR-202101-0079 CVE-2020-11143 plural  Qualcomm  Out-of-bounds write vulnerabilities in the product CVSS V2: 10.0
CVSS V3: 9.8
Severity: CRITICAL
Out of bound memory access during music playback with modified content due to copying data without checking destination buffer size in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking. plural Qualcomm The product contains a vulnerability related to out-of-bounds writing.Information is obtained, information is tampered with, and service is disrupted (DoS) It may be put into a state. The Qualcomm chip is a chip of Qualcomm (Qualcomm). A way to miniaturize circuits (mainly including semiconductor equipment, but also passive components, etc.) and often manufactured on the surface of semiconductor wafers. Many Qualcomm products have a buffer error vulnerability. The vulnerability is caused by copying data without checking the size of the target buffer. Therefore, the memory access range is exceeded by modifying the content during music playback
VAR-202101-0066 CVE-2020-11119 plural  Qualcomm  Out-of-bounds read vulnerabilities in the product CVSS V2: 5.0
CVSS V3: 7.5
Severity: HIGH
Buffer over-read can happen when the buffer length received from response handlers is more than the size of the payload in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wired Infrastructure and Networking. plural Qualcomm The product contains a vulnerability related to out-of-bounds reading and a vulnerability related to input verification.Denial of service (DoS) It may be put into a state. The Qualcomm chip is a chip of Qualcomm (Qualcomm). A way to miniaturize circuits (mainly including semiconductor equipment, but also passive components, etc.) and often manufactured on the surface of semiconductor wafers. Many Qualcomm products have buffer error vulnerabilities. The vulnerability stems from buffer overreading when the length of the buffer received from the response handler is greater than the size of the payload in Snapdragon Auto
VAR-202101-0008 CVE-2020-11137 plural  Qualcomm  Integer overflow vulnerability in product CVSS V2: 10.0
CVSS V3: 9.8
Severity: CRITICAL
Integer multiplication overflow resulting in lower buffer size allocation than expected causes memory access out of bounds resulting in possible device instability in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking. plural Qualcomm The product is vulnerable to integer overflow.Information is obtained, information is tampered with, and service is disrupted (DoS) It may be put into a state. The Qualcomm chip is a chip of Qualcomm (Qualcomm). A way to miniaturize circuits (mainly including semiconductor equipment, but also passive components, etc.) and often manufactured on the surface of semiconductor wafers. Many Qualcomm products have input validation error vulnerabilities, which are caused by integer multiplication overflow buffer size allocation and memory access out of bounds
VAR-202101-0010 CVE-2020-11139 plural  Qualcomm  Out-of-bounds write vulnerabilities in the product CVSS V2: 5.0
CVSS V3: 7.5
Severity: HIGH
Out of bound memory access while processing frames due to lack of check of invalid frames received in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking. plural Qualcomm The product contains a vulnerability related to out-of-bounds writing.Denial of service (DoS) It may be put into a state. The Qualcomm chip is a chip of Qualcomm (Qualcomm). A way to miniaturize circuits (mainly including semiconductor equipment, but also passive components, etc.) and often manufactured on the surface of semiconductor wafers. Many Qualcomm products have buffer error vulnerabilities, which are caused by not checking the received invalid frames when processing frames
VAR-202101-0009 CVE-2020-11138 plural  Qualcomm  Product Uninitialized Pointer Access Vulnerability CVSS V2: 10.0
CVSS V3: 9.8
Severity: CRITICAL
Uninitialized pointers accessed during music play back with incorrect bit stream due to an uninitialized heap memory result in instability in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking. plural Qualcomm The product contains a vulnerability in accessing uninitialized pointers.Information is obtained, information is tampered with, and service is disrupted (DoS) It may be put into a state. The Qualcomm chip is a chip of Qualcomm (Qualcomm). A way to miniaturize circuits (mainly including semiconductor equipment, but also passive components, etc.) and often manufactured on the surface of semiconductor wafers. Many Qualcomm products have buffer error vulnerabilities, which originate from uninitialized heap memory, and use incorrect bitstreams to access uninitialized pointers during music playback
VAR-202101-0006 CVE-2020-11140 plural  Qualcomm  Out-of-bounds write vulnerabilities in the product CVSS V2: 10.0
CVSS V3: 9.8
Severity: CRITICAL
Out of bound memory access during music playback with ALAC modified content due to improper validation in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking. plural Qualcomm The product contains a vulnerability related to out-of-bounds writing.Information is obtained, information is tampered with, and service is disrupted (DoS) It may be put into a state. The Qualcomm chip is a chip of Qualcomm (Qualcomm). A way to miniaturize circuits (mainly including semiconductor equipment, but also passive components, etc.) and often manufactured on the surface of semiconductor wafers. Many Qualcomm products have buffer error vulnerabilities. The vulnerabilities are caused by incorrect verification when playing music. ALAC modified the content, causing memory access out of bounds
VAR-202101-0007 CVE-2020-11136 plural  Qualcomm  Out-of-bounds read vulnerabilities in the product CVSS V2: 10.0
CVSS V3: 9.8
Severity: CRITICAL
Buffer Over-read in audio driver while using malloc management function due to not returning NULL for zero sized memory requirement in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking. plural Qualcomm The product contains an out-of-bounds read vulnerability.Information is obtained, information is tampered with, and service is disrupted (DoS) It may be put into a state. The Qualcomm chip is a chip of Qualcomm (Qualcomm). A way to miniaturize circuits (mainly including semiconductor equipment, but also passive components, etc.) and often manufactured on the surface of semiconductor wafers. Many Qualcomm products have buffer error vulnerabilities. The vulnerability stems from the fact that the buffer of the audio driver is overread when the malloc management function is used because the memory requirement of zero size does not return NULL
VAR-202101-0101 CVE-2020-11217 plural  Qualcomm  Product Double Release Vulnerability CVSS V2: 4.6
CVSS V3: 7.8
Severity: HIGH
A possible double free or invalid memory access in audio driver while reading Speaker Protection parameters in Snapdragon Compute, Snapdragon Connectivity, Snapdragon Industrial IOT, Snapdragon Mobile. plural Qualcomm The product contains a double release vulnerability.Information is obtained, information is tampered with, and service is disrupted (DoS) It may be put into a state. The Qualcomm chip is a chip of Qualcomm (Qualcomm). A way to miniaturize circuits (mainly including semiconductor equipment, but also passive components, etc.) and often manufactured on the surface of semiconductor wafers
VAR-202101-0085 CVE-2020-11150 plural  Qualcomm  Buffer error vulnerability in the product CVSS V2: 7.2
CVSS V3: 6.7
Severity: MEDIUM
Out of bound memory access in camera driver due to improper validation on data coming from UMD which is used for offset manipulation of pointer in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables. plural Qualcomm The product contains a buffer error vulnerability.Information is obtained, information is tampered with, and service is disrupted (DoS) It may be put into a state. The Qualcomm chip is a chip of Qualcomm (Qualcomm). A way to miniaturize circuits (mainly including semiconductor equipment, but also passive components, etc.) and often manufactured on the surface of semiconductor wafers. Many Qualcomm products have a buffer error vulnerability. The vulnerability stems from incorrect verification of data from UMD (used for pointer offset operations), which causes memory access in the camera driver to go out of range