VARIoT IoT vulnerabilities database

An issue was discovered in TimaService on Samsung mobile devices with O(8.x), P(9.0), and Q(10.0) software. PendingIntent with an empty intent is mishandled, allowing an attacker to perform a privileged action via a modified intent. The Samsung ID is SVE-2020-18418 (October 2020). This vulnerability is Samsung ID: SVE-2020-18418 It is published as.Information is obtained, information is tampered with, and service is disrupted (DoS) It may be put into a state. are all products of South Korean Samsung (Samsung). The vulnerability originates from TimaService

An issue was discovered on Samsung mobile devices with Q(10.0) and R(11.0) (Exynos chipsets) software. They allow attackers to obtain sensitive information by reading a log. The Samsung ID is SVE-2020-18596 (October 2020). Samsung Mobile devices contain a vulnerability related to information leakage from log files. This vulnerability is Samsung ID: SVE-2020-18596 It is published as.Information may be obtained

An issue was discovered on Samsung mobile devices with O(8.x), P(9.0), Q(10.0), and R(11.0) software. An attacker can access certain Secure Folder content via a debugging command. The Samsung ID is SVE-2020-18673 (October 2020). This vulnerability is Samsung ID: SVE-2020-18673 It is published as.Information may be obtained. are all products of South Korean Samsung (Samsung). Samsung mobile devices O (8.x), P (9.0), Q (10.0) and R (11.0) have security vulnerabilities

An issue was discovered on Samsung mobile devices with Q(10.0) software. The DynamicLockscreen Terms and Conditions can be accepted without authentication. The Samsung ID is SVE-2020-17079 (October 2020). This vulnerability is Samsung ID: SVE-2020-17079 It is published as.Information may be tampered with. Samsung mobile devices Q is a TV series of Samsung (Samsung) in South Korea. No detailed vulnerability details are currently provided

D-Link DAP-1360U before 3.0.1 devices allow remote authenticated users to execute arbitrary commands via shell metacharacters in the IP JSON value for ping (aka res_config_action=3&res_config_id=18). D-Link DAP-1360U A command injection vulnerability exists in the device.Information is obtained, information is tampered with, and service is disrupted (DoS) It may be put into a state. D-Link DAP-136 is a wireless network signal extender. D-Link DAP-136 has security vulnerabilities in processing IP parameters, allowing remote attackers to use the vulnerabilities to submit special requests and execute arbitrary commands in the context of the application

An issue was discovered in DirEncryptService on Samsung mobile devices with O(8.x), P(9.0), and Q(10.0) software. PendingIntent with an empty intent is mishandled, allowing an attacker to perform a privileged action via a modified intent. The Samsung ID is SVE-2020-18034 (October 2020). This vulnerability is Samsung ID: SVE-2020-18034 It is published as.Information may be tampered with. are all products of South Korean Samsung (Samsung). Samsung mobile devices O (8.x), P (9.0) and Q (10.0) have security vulnerabilities, which can be exploited by attackers to perform privileged operations by modifying intent

u'While processing invalid connection request PDU which is nonstandard (interval or timeout is 0) from central device may lead peripheral system enter into dead lock state.(This CVE is equivalent to InvalidConnectionRequest(CVE-2019-19193) mentioned in sweyntooth paper)' in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wired Infrastructure and Networking in Agatti, APQ8009, APQ8017, APQ8053, AR9344, Bitra, IPQ5018, Kamorta, MDM9607, MDM9640, MDM9650, MSM8996AU, Nicobar, QCA6174A, QCA6390, QCA6574AU, QCA9377, QCA9886, QCM6125, QCN7605, QCS404, QCS405, QCS605, QCS610, QRB5165, Rennell, SA415M, SA515M, Saipan, SC7180, SC8180X, SDA845, SDM660, SDM670, SDM710, SDM845, SDM850, SDX20, SDX24, SDX55, SM6150, SM7150, SM8150, SM8250, SXR1130, SXR2130. plural Snapdragon The product contains an input verification vulnerability.Denial of service (DoS) It may be put into a state. The Qualcomm chip is a chip of Qualcomm (Qualcomm). A way to miniaturize circuits (mainly including semiconductor equipment, but also passive components, etc.) and often manufactured on the surface of semiconductor wafers. Many Qualcomm products have input verification error vulnerabilities. The vulnerability stems from the fact that when processing invalid connection requests from the central device, if the PDU is not standard, it may cause the peripheral system to enter a deadlock state

u'Third-party app may also call the broadcasts in Perfdump and cause privilege escalation issue due to improper access control' in Snapdragon Auto, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wearables in Agatti, APQ8096AU, APQ8098, Bitra, Kamorta, MSM8909W, MSM8917, MSM8940, Nicobar, QCA6390, QCM2150, QCS605, Rennell, SA6155P, SA8155P, Saipan, SDA660, SDM429W, SDM450, SDM630, SDM636, SDM660, SDM670, SDM710, SM6150, SM7150, SM8150, SM8250, SXR1130, SXR2130. plural Qualcomm The product contains unspecified vulnerabilities.Information is obtained, information is tampered with, and service is disrupted (DoS) It may be put into a state

u'Buffer over-read issue in Bluetooth peripheral firmware due to lack of check for invalid opcode and length of opcode received from central device(This CVE is equivalent to Link Layer Length Overfow issue (CVE-2019-16336,CVE-2019-17519) and Silent Length Overflow issue(CVE-2019-17518) mentioned in sweyntooth paper)' in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music in APQ8053, APQ8076, AR9344, Bitra, Kamorta, MDM9206, MDM9207C, MDM9607, MSM8905, MSM8917, MSM8937, MSM8940, MSM8953, Nicobar, QCA6174A, QCA9377, QCM2150, QCM6125, QCS404, QCS405, QCS605, QCS610, QM215, Rennell, SC8180X, SDM429, SDM439, SDM450, SDM630, SDM632, SDM636, SDM660, SDM670, SDM710, SDM845, SDX20, SDX24, SM6150, SM7150, SM8150, SXR1130. plural Qualcomm The product contains an out-of-bounds read vulnerability. This vulnerability is CVE-2019-16336 , CVE-2019-17519 , CVE-2019-17518 It is the same vulnerability as.Information is obtained, information is tampered with, and service is disrupted (DoS) It may be put into a state. The Qualcomm chip is a chip of Qualcomm (Qualcomm). A way to miniaturize circuits (mainly including semiconductor equipment, but also passive components, etc.) and often manufactured on the surface of semiconductor wafers. Many Qualcomm products have buffer error vulnerabilities. The vulnerability stems from the lack of checks for invalid opcodes and the opcode length of the central device in Bluetooth peripheral firmware

u'Remote code execution can happen by sending a carefully crafted POST query when Device configuration is accessed from a tethered client through webserver due to lack of array bound check.' in Snapdragon Auto, Snapdragon Compute, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking in APQ8009, APQ8017, APQ8053, APQ8096AU, APQ8098, IPQ4019, IPQ6018, IPQ8064, IPQ8074, MDM9150, MDM9206, MDM9207C, MDM9607, MDM9640, MDM9650, MSM8905, MSM8909W, MSM8953, MSM8996AU, QCA6574AU, QCS405, QCS610, QRB5165, SC8180X, SDA660, SDA845, SDM429, SDM429W, SDM630, SDM632, SDM636, SDM660, SDM845, SDX20, SDX24, SDX55, SM8250. plural Qualcomm The product contains a classic buffer overflow vulnerability.Information is obtained, information is tampered with, and service is disrupted (DoS) It may be put into a state

u'Buffer overflow can happen as part of SIP message packet processing while storing values in array due to lack of check to validate the index length' in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wearables in Agatti, APQ8053, APQ8096AU, APQ8098, Bitra, Kamorta, MSM8905, MSM8909W, MSM8917, MSM8940, MSM8953, MSM8996AU, Nicobar, QCA6390, QCA6574AU, QCM2150, QCS605, QM215, Rennell, SA6155P, SA8155P, Saipan, SDA660, SDM429, SDM429W, SDM439, SDM450, SDM630, SDM632, SDM636, SDM660, SDM670, SDM710, SDM845, SM6150, SM7150, SM8150, SM8250, SXR1130, SXR2130. plural Qualcomm The product contains a vulnerability in array index validation.Information is obtained, information is tampered with, and service is disrupted (DoS) It may be put into a state

u'Potential out of bounds read while processing downlink NAS transport message due to improper length check of Information Element(IEI) NAS message container' in Snapdragon Auto, Snapdragon Compute, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wearables in Agatti, APQ8053, APQ8096AU, APQ8098, Kamorta, MDM9150, MDM9205, MDM9206, MDM9625, MDM9635M, MDM9640, MDM9645, MDM9650, MDM9655, MSM8905, MSM8909W, MSM8917, MSM8940, MSM8953, MSM8996AU, MSM8998, Nicobar, QCM2150, QCM6125, QCS605, QCS610, QM215, Rennell, SA415M, Saipan, SC7180, SC8180X, SDA660, SDA845, SDM429, SDM429W, SDM439, SDM450, SDM630, SDM632, SDM636, SDM660, SDM670, SDM710, SDM845, SDM850, SDX20, SDX24, SDX55, SM6150, SM7150, SM8150, SXR1130. plural Qualcomm The product contains an out-of-bounds read vulnerability.Information is obtained and denial of service (DoS) It may be put into a state

u'Buffer overflow occurs while processing SIP message packet due to lack of check of index validation before copying into it' in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wearables in Agatti, APQ8053, APQ8096AU, APQ8098, Bitra, Kamorta, MSM8905, MSM8909W, MSM8917, MSM8940, MSM8953, MSM8996AU, MSM8998, Nicobar, QCA6390, QCA6574AU, QCM2150, QCS605, QM215, Rennell, SA6155P, SA8155P, Saipan, SDA660, SDM429, SDM429W, SDM439, SDM450, SDM630, SDM632, SDM636, SDM660, SDM670, SDM710, SDM845, SM6150, SM7150, SM8150, SM8250, SXR1130, SXR2130. plural Qualcomm The product contains a vulnerability in array index validation.Information is obtained, information is tampered with, and service is disrupted (DoS) It may be put into a state

u'Array index underflow issue in adsp driver due to improper check of channel id before used as array index.' in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking in Agatti, APQ8009, APQ8017, APQ8053, APQ8096AU, APQ8098, Bitra, IPQ4019, IPQ5018, IPQ6018, IPQ8064, IPQ8074, Kamorta, MDM9607, MDM9640, MDM9650, MSM8905, MSM8909W, MSM8953, MSM8996AU, QCA6390, QCA9531, QCM2150, QCS404, QCS405, QCS605, SA415M, SA515M, SA6155P, SA8155P, Saipan, SC8180X, SDA660, SDA845, SDM429, SDM429W, SDM630, SDM632, SDM636, SDM660, SDM670, SDM710, SDM845, SDX20, SDX24, SDX55, SM6150, SM8150, SM8250, SXR1130, SXR2130. plural Qualcomm The product contains a vulnerability in array index validation.Information is obtained, information is tampered with, and service is disrupted (DoS) It may be put into a state. The Qualcomm chip is a chip of Qualcomm (Qualcomm). A way to miniaturize circuits (mainly including semiconductor equipment, but also passive components, etc.) and often manufactured on the surface of semiconductor wafers. A number of Qualcomm products have an input validation error vulnerability, which stems from improper check of the channel id before using the array index in the adsp driver

u'Two threads running simultaneously from user space can lead to race condition in fastRPC driver' in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking in Agatti, APQ8053, Bitra, IPQ4019, IPQ5018, IPQ6018, IPQ8064, IPQ8074, Kamorta, MDM9607, MSM8953, Nicobar, QCA6390, QCS404, QCS405, QCS610, Rennell, SA515M, SA6155P, SA8155P, Saipan, SC8180X, SDA845, SDM429, SDM429W, SDM632, SDM660, SDX55, SM6150, SM7150, SM8150, SM8250, SXR2130. plural Qualcomm The product contains a vulnerability related to the use of freed memory.Information is obtained, information is tampered with, and service is disrupted (DoS) It may be put into a state. The Qualcomm chip is a chip of Qualcomm (Qualcomm). A way to miniaturize circuits (mainly including semiconductor equipment, but also passive components, etc.) and often manufactured on the surface of semiconductor wafers. Many Qualcomm products have a resource management error vulnerability. The vulnerability originates from the fact that two threads running at the same time may cause race conditions in the fastRPC driver

u'Possible buffer overflow in MHI driver due to lack of input parameter validation of EOT events received from MHI device side' in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking in Agatti, APQ8009, Bitra, IPQ4019, IPQ5018, IPQ6018, IPQ8064, IPQ8074, Kamorta, MDM9607, MSM8917, MSM8953, Nicobar, QCA6390, QCM2150, QCS404, QCS405, QCS605, QM215, QRB5165, Rennell, SA415M, SA515M, SA6155P, SA8155P, Saipan, SC8180X, SDM429, SDM429W, SDM439, SDM450, SDM632, SDM710, SDM845, SDX55, SM6150, SM7150, SM8150, SM8250, SXR2130. plural Qualcomm The product contains a classic buffer overflow vulnerability.Information is obtained, information is tampered with, and service is disrupted (DoS) It may be put into a state

u'Out of bound access can happen in MHI command process due to lack of check of channel id value received from MHI devices' in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking in Agatti, APQ8009, Bitra, IPQ4019, IPQ5018, IPQ6018, IPQ8064, IPQ8074, Kamorta, MDM9150, MDM9607, MDM9650, MSM8905, MSM8917, MSM8953, Nicobar, QCA6390, QCA9531, QCM2150, QCS404, QCS405, QCS605, QCS610, QM215, QRB5165, Rennell, SA415M, SA515M, SA6155P, SA8155P, Saipan, SC8180X, SDM429, SDM429W, SDM439, SDM450, SDM632, SDM660, SDM670, SDM710, SDM845, SDX55, SM6150, SM7150, SM8150, SM8250, SXR1130, SXR2130. plural Qualcomm The product contains a vulnerability related to out-of-bounds writing.Information is obtained, information is tampered with, and service is disrupted (DoS) It may be put into a state. Qualcomm MDM9607, etc. are all products of Qualcomm. MDM9607 is a central processing unit (CPU) product. MDM9650 is a central processing unit (CPU) product. SDM660 is a central processing unit (CPU) product. QCS404 is a central processing unit (CPU) product. QCS605 is a central processing unit (CPU) product. SDX55 is a modem. SDM670 is a central processing unit (CPU) product. SDM710 is a central processing unit (CPU) product. MSM8917 is a central processing unit (CPU) product. SXR2130 is a central processing unit (CPU) product. SDM439 is a central processing unit (CPU) product. MSM8905 is a central processing unit (CPU) product. IPQ6018 is a central processing unit (CPU) product. QCA6390 is a central processing unit (CPU) product. Rennell is a central processing unit (CPU) product. Wire etc. are the products of individual developers. Wire is a chat software. Qualcomm APQ8009 is a central processing unit. Many Qualcomm products have buffer error vulnerabilities. The vulnerability stems from the lack of checking the channel id value received from the MHI device, and out-of-bounds access may occur

u'Lack of handling unexpected control messages while encryption was in progress can terminate the connection and thus leading to a DoS' in Snapdragon Auto, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables in APQ8053, APQ8076, MDM9640, MDM9650, MSM8905, MSM8917, MSM8937, MSM8940, MSM8953, QCA6174A, QCA9886, QCM2150, QM215, SDM429, SDM439, SDM450, SDM632. plural Qualcomm The product contains an input verification vulnerability.Denial of service (DoS) It may be put into a state. The Qualcomm chip is a chip of Qualcomm (Qualcomm). A way to miniaturize circuits (mainly including semiconductor equipment, but also passive components, etc.) and often manufactured on the surface of semiconductor wafers. Many Qualcomm products have input validation errors. The vulnerability stems from the lack of ability of u to handle unexpected control messages during the encryption process, which leads to DoS

u'Possible buffer overflow while updating output buffer for IMEI and Gateway Address due to lack of check of input validation for parameters received from server' in Snapdragon Auto, Snapdragon Compute, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile in Agatti, Kamorta, Nicobar, QCM6125, QCS610, Rennell, SA415M, Saipan, SC7180, SC8180X, SDX24, SDX55, SM6150, SM7150, SM8150, SM8250, SXR2130. plural Qualcomm The product contains a classic buffer overflow vulnerability.Information is obtained, information is tampered with, and service is disrupted (DoS) It may be put into a state

u'Buffer over-read issue in Bluetooth estack due to lack of check for invalid length of L2cap packet received from peer device.' in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wired Infrastructure and Networking in QCA6390, QCN7605, QCS404, SA415M, SA515M, SC8180X, SDX55, SM8250. plural Qualcomm The product contains an input verification vulnerability.Information is obtained and denial of service (DoS) It may be put into a state. The Qualcomm chip is a chip of Qualcomm (Qualcomm). A way to miniaturize circuits (mainly including semiconductor equipment, but also passive components, etc.) and often manufactured on the surface of semiconductor wafers. A number of Qualcomm products have an input verification error vulnerability. The vulnerability stems from the failure to check the length of the received L2cap data packet, which causes the buffer overread problem in the Bluetooth estack